Automatic Terminal Common Inductor Winding Machine

Automatic Terminal Common Core Bonding Machine is a highly stable and precisely controlled intelligent device specially designed for the efficient bonding process of terminal common mode cores. Relying on self-developed bus control technology and an AI visual inspection system, the equipment achieves full-process automation from core feeding, precise dispensing, visual inspection to tunnel oven baking.

Performance

● Automatic Terminal Common Core Bonding Machine features ultra-precise dispensing control with a dispensing accuracy of ±0.005g. A bus-type controller is used to precisely adjust the glue volume of multiple axes, with glue volume fluctuation <0.02%, adapting to the micro-quantitative needs of core bonding and avoiding defects caused by glue overflow or insufficiency.

● The AI visual inspection system real-time scans the dispensing position and glue volume. Combined with CCD image analysis, it automatically corrects offset errors, achieving a dispensing position accuracy of ±0.01mm and a 100% detection rate for bonding offset.

● The production capacity of a single device reaches 2,600 PCS/H, a 400% increase compared to traditional manual lines. One operator can handle 4 machines, reducing labor costs by 75%.

● The fully automated process, seamlessly connecting feeding→dispensing→inspection→baking, features a three-zone tunnel oven with a temperature difference ≤5°C and baking uniformity ≥98%, ensuring consistent core bonding strength.

● Automatic Terminal Common Core Bonding Machine supports mainstream models such as 3225&4532. Through PLC + fiber optic sensor intelligent core model recognition, process parameters can be switched with one click, adapting to small-batch and multi-variety production scenarios.

● A built-in Ethernet communication module real-time uploads data, seamlessly accessing the MES system to support remote monitoring and process parameter adjustment, enabling full-process production traceability.

Features

● Using an industrial-grade bus-type controller, pulse signal stability is improved by 80%, with strong anti-interference capabilities to ensure delay-free multi-axis collaborative operations.

● The vibration plate undergoes surface hardening treatment + PLC fiber optic detection, enhancing wear resistance by 3 times. The core feeding yield ≥99.5% eliminates material reversal and jamming.

● Dual CCD vision modules: the first group detects the dispensing position and glue volume, providing real-time feedback to the dispensing valve for dynamic adjustment; the second group detects core bonding offset and automatically rejects products with excessive offsets, achieving a process yield ≥99.8%.

● With an AI self-learning algorithm, the system can automatically recognize the dispensing paths of different models, reducing the new model parameter training cycle to <1 hour and lowering debugging costs.

● The modular structure supports quick disassembly and replacement of core components (e.g., dispensing valves, vibration plates, tunnel ovens) within 15 minutes, reducing annual maintenance costs by 60%.

Highlights

● Independent research and development of core technologies.

● Micro-metering dispensing technology with ±0.005g-level dispensing accuracy meets the ultra-precision bonding needs of core gaps below 0.1mm, suitable for high-end electronic component production.

● "One machine for two models" supports both 3225 and 4532 models, reducing repeated equipment procurement.

● Intelligent automatic detection functions such as material shortage detection, glue volume abnormal alarm, and automatic shutdown for excessive baking temperature intercept 100% of production hazards.

Product parameters